研削盤 - Nippon Seiko Co., Ltd.

Title:

研削盤

Document Type and Number:

Japanese Patent JP5725089

Kind Code:

B2

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Inventors:

Kengo Mizuura
Tetsuya Goto
Maruyama Miyuki

Application Number:

JP2013122503A

Publication Date:

May 27, 2015

Filing Date:

June 11, 2013

Export Citation:

Assignee:

Nippon Seiko Co., Ltd.

International Classes:

B24B5/18; B24B5/22; B24B5/307; B24B7/16

Domestic Patent References:

Foreign References:

GB354498A

Attorney, Agent or Firm:

Kiwa Patent Office

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