Title:
研削盤
Document Type and Number:
Japanese Patent JP7128635
Kind Code:
B2
Abstract:
To provide a grinding machine which grinds a wafer with a high degree of accuracy in consideration of wear of a grinding stone.SOLUTION: A grinding machine 1 comprises: a rotatable spindle 23 to a lower end of which a grinding stone 21 is fitted; a spindle feeding mechanism 25 which feeds the spindle 23 in a vertical direction V with respect to a column 22; a constant pressure cylinder 26 which lifts the spindle 23 and the spindle feeding mechanism 25 in the vertical direction V when the grinding stone 21 cuts into the wafer W and a friction force acting on the grinding stone 21 is higher than a prescribed value; an in-process gauge 4 which measures a ground amount Δt which is amount of the wafer W ground by the grinding stone 21; a linear encoder 5 which measures a displacement magnitude Δv which is magnitude of lowering of the spindle 23; and a control unit 6 which compares a real wear speed of the grinding stone 21 calculated based on the displacement magnitude Δv and the ground amount Δt, with a prestored proper wear speed range of the grinding stone 21.SELECTED DRAWING: Figure 5
Inventors:
Fumio Mase
Masaki Kanazawa
Masaki Kanazawa
Application Number:
JP2018041348A
Publication Date:
August 31, 2022
Filing Date:
March 07, 2018
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B49/04; B24B7/04; B24B53/02; H01L21/304
Domestic Patent References:
| JP2005021998A | ||||
| JP6030265B1 | ||||
| JP2014159049A | ||||
| JP2004249358A | ||||
| JP2009107084A |
Attorney, Agent or Firm:
Takamitsu Shimizu