Title:
GRINDING ABRASIVE GRAIN AND CHEMICAL MACHINE-GRINDING SLURRY
Document Type and Number:
Japanese Patent JP2001240848
Kind Code:
A
Abstract:
To provide grinding abrasive grains not showing a change with time cause by the effect of a co-presenting substance and being washed out from a treated material after its grinding.
In the grinding abrasive grains used as chemical machine- grinding (CMP) slurry, a polysiloxane coated film informed on the entire surface of hard inorganic compound particles such as an alumina, a θ-alumina or the like. The above polysiloxane coated film is formed by performing chemical vapor deposition with a siloxane-based compound and a Si-H group addition reacting on the inorganic compound fine particles in a chamber, and further making them as hydrophilic by performing a heat-treatment or hydroxylation reaction.
Inventors:
SAKURAI NAOAKI
NONAKA MIKIO
CHIYOU SHIYUNREN
HIRABAYASHI HIDEAKI
KANAMARU TETSUYA
ONO KAZUHISA
NONAKA MIKIO
CHIYOU SHIYUNREN
HIRABAYASHI HIDEAKI
KANAMARU TETSUYA
ONO KAZUHISA
Application Number:
JP2000055761A
Publication Date:
September 04, 2001
Filing Date:
March 01, 2000
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
TAMA KAGAKU KOGYO KK
TOSHIBA CORP
SHISEIDO CO LTD
TAMA KAGAKU KOGYO KK
TOSHIBA CORP
SHISEIDO CO LTD
International Classes:
B24B37/00; C09K3/14; C23C16/30; H01L21/304; (IPC1-7): C09K3/14; B24B37/00; C23C16/30; H01L21/304
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)