Title:
研削状態監視方法、研削状態監視プログラムおよび研削状態監視装置
Document Type and Number:
Japanese Patent JP7015807
Kind Code:
B2
Abstract:
To improve accuracy in prediction of grinding quality.SOLUTION: A grinding quality prediction device acquires information indicating transition of a power value that drives a grinding wheel and quality of a grinding object when the grinding object is ground using the grinding wheel. The grinding quality prediction device extracts a power value of a common part of a plurality of grinding objects to be ground using the grinding wheel that is a power value when the grinding wheel grinds the common part, from the transition of the power value. The grinding quality prediction device generates a quality prediction model for predicting a grinding state by using data based on the power value of the common part and the information indicating the quality of the grinding object.SELECTED DRAWING: Figure 2
Inventors:
Tatsuya Yamamoto
Oba Taku
Kota Tajima
Ryosuke Wakasugi
Kenta Ishiwaki
Oba Taku
Kota Tajima
Ryosuke Wakasugi
Kenta Ishiwaki
Application Number:
JP2019126531A
Publication Date:
February 03, 2022
Filing Date:
July 05, 2019
Export Citation:
Assignee:
富士通株式会社
International Classes:
B24B49/16; B24B19/12; G05B19/4155
Domestic Patent References:
| JP2017097839A | ||||
| JP2018106562A | ||||
| JP2018001301A | ||||
| JP5985124B1 | ||||
| JP2000288895A |
Attorney, Agent or Firm:
Sakai International Patent Office
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