Title:
GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2019141946
Kind Code:
A
Abstract:
To provide a grinding device that can efficiently perform grinding processing and measures a shape of a wafer with a simple structure having a small number of components.SOLUTION: A grinding device 1 comprises: a stationary type thickness measuring instrument 8 for performing fixed-point measurement of a thickness of a wafer W; a mobile thickness measuring instrument 7 that measures a thickness of the wafer W while moving in a radial direction R of the wafer W; and a control device 9 that calculates a shape of the wafer W by subtracting a measured value T1 by the stationary-type thickness measuring instrument 8 from a measured value T2 by the mobile thickness measuring instrument 7.SELECTED DRAWING: Figure 8
Inventors:
MASE FUMIO
Application Number:
JP2018027436A
Publication Date:
August 29, 2019
Filing Date:
February 19, 2018
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B49/04; B24B7/04; B24B7/22; B24B41/06; B24B49/12; B24B55/02; H01L21/304
Domestic Patent References:
| JP2008264913A | 2008-11-06 | |||
| JP2013119123A | 2013-06-17 | |||
| JP2005195545A | 2005-07-21 | |||
| JP2016182644A | 2016-10-20 | |||
| JP2007335458A | 2007-12-27 | |||
| JP2009246240A | 2009-10-22 |
Attorney, Agent or Firm:
Takamitsu Shimizu