Title:
研削装置
Document Type and Number:
Japanese Patent JP5550971
Kind Code:
B2
Inventors:
Seizo Takamura
Aoki Seiji
Aoki Seiji
Application Number:
JP2010092982A
Publication Date:
July 16, 2014
Filing Date:
April 14, 2010
Export Citation:
Assignee:
トーヨーエイテック, Inc.
International Classes:
B24B21/00; B24B11/00; B24B21/02; B24B21/22; B24D11/00
Attorney, Agent or Firm:
Etsuji Kotani
Otari 昌崇
Toshiro Muramatsu
Otari 昌崇
Toshiro Muramatsu
Previous Patent: JPS5550970
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