Title:
研削装置
Document Type and Number:
Japanese Patent JP6825935
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to confirm that a spinner table is mounted to a grinding apparatus.SOLUTION: In this grinding apparatus, a height position Z1 of a robot hand 40, which is recognized by lifting means in the case that a height position of an adsorption face 400 of the robot hand 40 directed downward and a height position of a holding surface 500a of a spinner table 50 are coincident with each other, is stored in height storage means. When checking whether the spinner table 50 is mounted or not, a wafer detection sensor 402 provided on the robot hand 40 is lowered to a height of a position, at which the it is assumed that there is the spinner table 50, stored by the height storage means, when the wafer detection sensor 402 provided on the robot hand 40 is switched ON, it is determined that the spinner table 50 is mounted, and when the wafer detection sensor 402 is switched OFF, it is determined that the spinner table 50 is not mounted.SELECTED DRAWING: Figure 4
Inventors:
Satoshi Yamanaka
Application Number:
JP2017034718A
Publication Date:
February 03, 2021
Filing Date:
February 27, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B49/12; B24B7/00; B24B7/04; B24B41/06; B24B51/00; B24B55/06; H01L21/304
Domestic Patent References:
| JP2011031352A | ||||
| JP11320395A | ||||
| JP2005260065A | ||||
| JP2008300668A |
Foreign References:
| US20090088047 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office