Title:
研削装置
Document Type and Number:
Japanese Patent JP6869051
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a grinder which dresses a ground surface of a ground grindstone into a curved shape according to a desired wafer shape.SOLUTION: A grinder 1 includes: a wafer chuck 3 holding a wafer W; grinding means 2 having a ground grindstone 21 grinding the wafer W; and a dress unit dressing the ground grindstone 21. The dress unit includes: a tilt table 91 which can tilt a dress board 81 to a rotation axis of the ground grindstone 21; and a control device adjusting a tilt angle of the tilt table 91.SELECTED DRAWING: Figure 2
Inventors:
Tobiyama Hirotsugu
Application Number:
JP2017035588A
Publication Date:
May 12, 2021
Filing Date:
February 27, 2017
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B53/02; B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2000317835A | ||||
| JP2002346910A | ||||
| JP2007175825A | ||||
| JP2003257911A |
Attorney, Agent or Firm:
Takamitsu Shimizu