Title:
研削加工装置及び研削加工方法
Document Type and Number:
Japanese Patent JP6972556
Kind Code:
B2
Abstract:
A grinding apparatus includes grinding wheel side vibrational displacement calculation devices that obtain a vibrational displacement of a grinding wheel resulting from a vibration in an approaching/separating direction of the grinding wheel; main spindle side vibrational displacement calculation devices that obtain a vibrational displacement of a workpiece generated by propagation of the vibration in the approaching/separating direction of the grinding wheel; a relative vibrational displacement calculation unit that obtains a relative vibrational displacement between the grinding wheel and the workpiece based on the vibrational displacement of the grinding wheel and the vibrational displacement of the workpiece that have been obtained; a position change unit that creates, based on the obtained relative vibrational displacement between the grinding wheel and the workpiece, a position change command to change a position of the wheel spindle stock; and a processing controller that grinds the workpiece W based on the created position change command.
Inventors:
Akira Watanabe
Application Number:
JP2017002055A
Publication Date:
November 24, 2021
Filing Date:
January 10, 2017
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B24B49/16; B23Q15/12; B23Q17/12; B24B5/02; B24B5/35; B24B41/06; B24B49/04; B24B49/10
Domestic Patent References:
| JP2010173014A | ||||
| JP2011143503A | ||||
| JP2011161520A | ||||
| JP2013237127A |
Foreign References:
| WO2003100374A1 |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji