Title:
研削装置
Document Type and Number:
Japanese Patent JP7227754
Kind Code:
B2
Abstract:
To prevent ground chips from adhering to an innermost segment grindstone when grinding a work-piece using a grinding wheel in which positions of segment grindstones are changed in a radial direction.SOLUTION: A grinding device 1 comprises: a wheel 35 in which a gap is formed between annularly adjacent segment grindstones 350 and the adjacent grindstones 350 are displaced in a radial direction; means 31 for grinding a work-piece with the grindstones 350; and a grinding water supply path 180 that opens to a free end face center of a mount 313, which further comprises a nozzle 37, fitted to the mount 313, which discharges grinding water toward a grindstone 350a arranged closest to a center of the wheel 35. The nozzle 37 comprises an inlet 372 for receiving grinding water through the grinding water supply path 180, a water-discharge port 373 formed equiangularly with the center of the mount 313 as a center, and a communication path 375 through which the inlet 372 communicates with the water-discharge port 373, where the water discharge port 373 is positioned so that grinding water receiving centrifugal force by rotation of a spindle 310 is supplied to the grindstone 350a arranged closest to the center of the wheel 35.SELECTED DRAWING: Figure 3
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Inventors:
Mamoru Kawana
Application Number:
JP2018232316A
Publication Date:
February 22, 2023
Filing Date:
December 12, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B55/02; B24B7/04; B24D7/06; B24D7/10; H01L21/304
Domestic Patent References:
| JP2002301645A | ||||
| JP2004188582A | ||||
| JP7186052A | ||||
| JP2011167818A |
Foreign References:
| US5243790 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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