Title:
研削装置
Document Type and Number:
Japanese Patent JP7278584
Kind Code:
B2
Abstract:
To provide a grinding device which has high versatility and can easily change an axial center position of a spindle.SOLUTION: A grinding device 10 comprises: a chuck table 50 having a holding surface 51 for holding a work-piece W; a grinding part 20 which grinds the work-piece W held on the holding surface 51; and a column 12 which supports the grinding part 20 so that the grinding part can be fed by grinding with respect to the holding surface 51. The grinding part 20 has: a grinding wheel 45 having a magnet 46; a spindle 35 which rotatably and detachably holds the grinding wheel 45; and at least one support part 22a which supports the spindle 35. The support part 22a is provided with an arrangement part 26a along an arrangement direction that is longer toward a horizontal direction and in a direction of approaching and separating with respect to the chuck table 50, and the spindle 35 is so supported as to be movable along a longer direction of the arrangement part 26a. Thus, arrangement of the spindle 35 can be changed along the arrangement part 26a.SELECTED DRAWING: Figure 2
More Like This:
| JP7076557 | Board processing system |
| WO/2012/078087 | A DEVICE FOR GRINDING OF PLANE SURFACES BY GRINDING MEANS |
| JP7355670 | Polishing head and polishing equipment |
Inventors:
Shinji Kimura
Hisashi Yoshida
Hisashi Yoshida
Application Number:
JP2019142511A
Publication Date:
May 22, 2023
Filing Date:
August 01, 2019
Export Citation:
Assignee:
Takatori Co., Ltd.
International Classes:
B24B41/047; B24B7/04; B24B41/06; B24B47/22
Domestic Patent References:
| JP2002200545A | ||||
| JP2008042081A | ||||
| JP2012086351A | ||||
| JP2003332410A |
Foreign References:
| US20170040202 |
Attorney, Agent or Firm:
▲崎▼山 博教