Title:
研削装置
Document Type and Number:
Japanese Patent JP7328104
Kind Code:
B2
Abstract:
To enable a pad to suction and hold a wafer even after self-grinding or the like.SOLUTION: A height of an arm 51 at the time when an optical axis L is cut off by a dog 54 when a lower surface 50b of a pad 50 is pushed down onto a holding surface 20a in a state where a wafer W is not placed on the holding surface 20a is preset, as a height of the arm 51 at the time when the pad 50 suctions and holds the wafer W, in a height setting part 9; then the wafer W is ground using grinding means 3, and thereafter the arm 51 is moved down to the preset height using lifting means 6, so as to make a lower surface 40b of the pad 50 contact an upper surface Wa of the wafer W. Thereafter, a suction source 59 is actuated to make the pad 50 suction and hold the wafer W and then convey the wafer W from the holding surface 20a.SELECTED DRAWING: Figure 4
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Inventors:
Masashi Ogata
Application Number:
JP2019176871A
Publication Date:
August 16, 2023
Filing Date:
September 27, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B49/02; B23Q7/04; B23Q17/20; B23Q17/22; B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2005177928A | ||||
| JP2018086693A | ||||
| JP2019087674A |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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