PURPOSE: To facilitate the pure water replacement of a grinder at the end of grinding operation by cutting a running out groove along the periphery of a substrate bonding surface of a grinding holder.

CONSTITUTION: For example, a running out groove 15 of 8mm wide, 5mm deep is cut along the outer periphery of a substrate holding surface 14a of a grinding holder 14. A plurality of GaAs substrates 16'' are bonded onto the substrate holding surface 14a inside the running out groove 15. The grinding holder 14 is fixed to an upper axle shaft 11 through the intermediary of a connecting part 13 and then a grinder is turned to perform the mirror-grinding operation while feeding hypochlorous acid base grinding solution. When the grinding holder 14 is pulled out of the grinder at the end of the grinding operation, cleaning water is taken in from a leading-in port 12 to be run out from the running out groove 15 to replace the grinding solution with pure water. Through these procedures, the surface grinding operation can be performed efficiently.