Title:
研削加工盤及び研削加工方法
Document Type and Number:
Japanese Patent JP5708324
Kind Code:
B2
Abstract:
Teaching (contacting) operation is performed, and from the contact position (SX), the workpiece (2) is ground by a given "test grinding amount (A)." Subsequently, the diameter of the workpiece is measured. Based on the result of the measurement, the residual amount to be ground (residual grinding amount) to obtain the finished dimension is calculated, and grinding by the "residual grinding amount (R)" is performed.
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Inventors:
Koji Nishide
Nakano Kan
Yoshikawa Ishikawa
Tsubasa Sakamoto
Nakano Kan
Yoshikawa Ishikawa
Tsubasa Sakamoto
Application Number:
JP2011153217A
Publication Date:
April 30, 2015
Filing Date:
July 11, 2011
Export Citation:
Assignee:
Nippon Seiko Co., Ltd.
International Classes:
B24B49/02; B23Q15/24
Domestic Patent References:
| JP4300160A | ||||
| JP2011045940A | ||||
| JP2008084130A | ||||
| JP2003094303A | ||||
| JP3029257U |
Attorney, Agent or Firm:
Kenji Iwaki
Yoshimi Kobayashi
Yoshimi Kobayashi