Title:
研削加工盤及び研削加工方法
Document Type and Number:
Japanese Patent JP5729178
Kind Code:
B2
Abstract:
With the center position (CP) of a support shaft (6) that supports the grindstone (4) as a reference, a tentative grinding start position (SO') for the initial workpiece is computed from the pre-grinding diameter (ID) of the initial workpiece (2), the diameter (WD) of the grindstone, the grinding completion position (S4) for the initial workpiece after grinding, and the actual grindstone grinding start position (S0) for each pre-grinding workpiece from the second workpiece onward. (S0) is determined by moving the grindstone from (SO'), performing grinding, and, in the vicinity of the grinding completion position (S4), separating the grindstone from the initial workpiece by a distance corresponding to (S4). Taking the margin (S±) between (SO') and (S0) into consideration, (SO') is set by computing (S0') = (ID) - (WD) - (S4) - (S±).
Inventors:
Koji Nishide
Application Number:
JP2011148538A
Publication Date:
June 03, 2015
Filing Date:
July 04, 2011
Export Citation:
Assignee:
Nippon Seiko Co., Ltd.
International Classes:
B24B49/02; B24B49/10; B24B51/00
Domestic Patent References:
| JP6262498A | ||||
| JP2011045940A | ||||
| JP2000094279A | ||||
| JP2004017194A | ||||
| JP2009184063A |
Attorney, Agent or Firm:
Kenji Iwaki
Yoshimi Kobayashi
Yoshimi Kobayashi