Title:
研削盤システム
Document Type and Number:
Japanese Patent JP6888396
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a grinder which can obtain desired surface roughness while grinding efficiently.SOLUTION: A grinder 1 includes a grinding wheel 50 which grinds a workpiece W, a sensor 100 which detects surface roughness of the workpiece W ground by the grinding wheel 50, and a control device 200 which determines a condition of grinding carried out after detection based on the surface roughness detected by the sensor 100 and grinds under the determined condition. The control device 200 grinds by determining a condition by which the surface roughness is below a threshold under the condition of grinding carried out after the detection when the detected surface roughness is beyond the predetermined threshold.SELECTED DRAWING: Figure 1
Inventors:
Hiroshi Morita
Eiji Fukuda
Mitsuharu Ishihara
Eiji Fukuda
Mitsuharu Ishihara
Application Number:
JP2017086850A
Publication Date:
June 16, 2021
Filing Date:
April 26, 2017
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B24B49/00; B24B5/04; B24B5/42; B24B49/02; B24B49/12; B24B51/00
Domestic Patent References:
| JP2095543A | ||||
| JP2005059141A | ||||
| JP3001758U |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji
Kiichi Yamamoto
Kobayashi Osamu
Kimura Gunji