Title:
GRINDING METAL BOND CHIP AND POLISHER DISK HAVING THIS CHIP AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP02284871
Kind Code:
A
Abstract:
PURPOSE: To attain adhesion of a grinding chip layer firmly to a metal bed by integrally forming with the metal bed by sintering to diffusion connect the grinding chip layer to the plating.
CONSTITUTION: After a metal bed 12 is placed in a carbon mold of a sintering machine, mixed dust of metal dust with diamond dust is placed in the mold and sintered, diffusion connecting a grinding chip layer 11 to a plated copper on surfaces of the metal bed 12. Thus, the grinding chip layer 11 can adhesively adhere to the metal bed 12 stronger than brazing.
Inventors:
Goto, Hiroshi
Kojima, Motokazu
Yasukura, Tooru
Kojima, Motokazu
Yasukura, Tooru
Application Number:
JP1989000106708
Publication Date:
November 22, 1990
Filing Date:
April 25, 1989
Export Citation:
Assignee:
SANWA KENMA KOGYO KK
International Classes:
B24B37/04; B24D3/00; B24D3/06; B24D5/06; B24D7/06; (IPC1-7): B24B37/04; B24D3/06; B24D5/06
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