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Title:
GRINDING METHOD AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JPH04365526
Kind Code:
A
Abstract:

PURPOSE: To shorten a lead time and improve accuracy by executing a first process and a second process of grinding working on a same machine.

CONSTITUTION: A compound working machine 1 is provided with a table 20 moving along a slideway 12 provided on a bed 10. A first headstock 30 is fitted on the table 20, and provided with a first main spindle 35. A second headstock 50 moving on a slideway provided on the table 20 is provided, and the second main spindle 55 of the second headstock 50 is arranged opposite to the first main spindle 35. A slideway 16 is provided on the bed in parallel with a slideway 14, and a grinding unit 70 is slidably supported with it. The grinding unit 70 is provided with an external grinding unit 74 and an internal grinding unit 76, and turned around an axis B. The first process of grinding working is executed on a work held with the first main spindle 35, and after transferring the work to the second main spindle 55, the second process is executed. By indexing the grinding unit 70 around the axis B, taper working can be executed. The internal grinding unit 76 can be controlled to move along a vertical shaft Y so as to enlarge the range of grinding working.


Inventors:
HARADA MASANAO
YOSHIDA HISASHI
IWATA KEIICHI
Application Number:
JP16617091A
Publication Date:
December 17, 1992
Filing Date:
June 12, 1991
Export Citation:
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Assignee:
KIWA GIKEN KK
International Classes:
B23B3/30; B23B11/00; B23P23/02; B23Q39/04; B24B41/00; (IPC1-7): B23B3/30; B23B11/00; B23P23/02; B24B41/00
Attorney, Agent or Firm:
Yoshiaki Numagata (1 person outside)