Title:
樹脂を含む複合基板の研削方法及び研削装置
Document Type and Number:
Japanese Patent JP7270373
Kind Code:
B2
Abstract:
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.
Inventors:
Eiichi Yamamoto
Takahiko Mitsui
Bando Tsubasa
Satoru Ide
Takahiko Mitsui
Bando Tsubasa
Satoru Ide
Application Number:
JP2018238095A
Publication Date:
May 10, 2023
Filing Date:
December 20, 2018
Export Citation:
Assignee:
Okamoto Machine Tool Co., Ltd.
International Classes:
H01L21/304; B24B7/22; B24B41/06; B24B53/007; B24B55/02
Domestic Patent References:
| JP2014028425A | ||||
| JP2016058655A | ||||
| JP2018049973A | ||||
| JP2015090945A | ||||
| JP2018186217A | ||||
| JP7009342A | ||||
| JP2007157930A |
Attorney, Agent or Firm:
Masahisa Ohtake