Title:
GRINDING METHOD AND MACHINE FOR EDGE OF DISK OR WAFER
Document Type and Number:
Japanese Patent JP2000117602
Kind Code:
A
Abstract:
To provide a grinding machine for grinding the edge of a disk or a wafer.
A grinding machine includes a groove-attached grinding wheel, a means for transferring a wafer before and after grinding, and a housing 332; and a wafer 340 is placed on a vacuum chuck 336 for waiting inspection in the housing 332. A nozzle 338 is protruded into the housing to guide water or air to the surface and edge of the wafer on the chuck, and then a transferring means transfers the water to an inspection station.
Inventors:
STOCKER MARK ANDREW
FALKNER DERMOT ROBERT
MORANTZ PAUL MARTIN
PIERSE MICHAEL GEORGE
FALKNER DERMOT ROBERT
MORANTZ PAUL MARTIN
PIERSE MICHAEL GEORGE
Application Number:
JP36501198A
Publication Date:
April 25, 2000
Filing Date:
June 11, 1997
Export Citation:
Assignee:
UNOVA UK LTD
International Classes:
B24B41/06; B23Q1/36; B23Q3/18; B23Q17/24; B24B1/00; B24B5/04; B24B5/06; B24B9/00; B24B9/06; B24B17/04; B24B17/06; B24B19/02; B24B41/00; B24B41/02; B24B41/04; B24B47/12; B24B49/00; B24B49/02; B24B49/12; B24B53/00; B24B53/07; B24B55/02; H01L21/304; H01L21/306; H01L21/66; H01L21/00; (IPC1-7): B24B9/00; B24B41/06; B24B55/02
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)