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Title:
GRINDING METHOD FOR WORKPIECE AND MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2009006447
Kind Code:
A
Abstract:

To provide a grinding method for a workpiece and a machining device therefor capable of suppressing generation of chattering vibration relatively easily without giving influence on the processing efficiency or accuracy.

The grinding method is to process the workpiece W with the cylindrical surface of a whetstone 30 or its end face through such procedures that the workpiece W is rotated round its rotational axis, and the whetstone 30 approximately in a cylindrically shape is rotated round the whetstone rotational axis parallel with the workpiece rotational axis and advanced and retreated relative to the workpiece W in the direction perpendicularly intersecting the workpiece rotational axis, or that the whetstone 30 is moved relative to the workpiece W in the direction parallel to the workpiece rotational axis, wherein an oscillating signal G20 including a plurality of frequency components is superposed on a drive signal to a workpiece rotating means 21, and grinding is performed while the rotating speed of the workpiece W is changed at minor intervals.


Inventors:
Osaki, Yoshitaro
Yonezu, Hisahiro
Nonoyama, Makoto
Application Number:
JP2007000170470
Publication Date:
January 15, 2009
Filing Date:
June 28, 2007
Export Citation:
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Assignee:
JTEKT CORP
International Classes:
B24B1/04; B23Q15/12; B24B5/04; B24B47/12
Domestic Patent References:
JPH088216A1996-01-12
JPH0911084A1997-01-14
JPH1177532A1999-03-23
JPS49135295A1974-12-26
JPS5256468A1977-05-09
JPS4926879A1974-03-09
JP2007044852A2007-02-22
Attorney, Agent or Firm:
特許業務法人岡田国際特許事務所