PURPOSE: To enhance the grinding performance in a grinding method which is suitable for bevelling the peripheral edge of a semi-conductor wafer, by extending and retracting a disk-like grind-wheel having, at both edges thereof, grinding surfaces between a pair or workpieces spaced at a predetermined distance.
CONSTITUTION: Upon grinding a pair of disk-like wafers 23 are at first sucked under vacuum to the absorbing surfaces 24a, 24b of spindles 20a, 20b. Then motors 30a, 30b are started to rotate the spindles 20a, 20b while motors 15a, 15b are started to move feed tables 12a, 12b so that the grinding surfaces 39a, 39b of a grind-wheel 39 which are formed to have a predetermined bevel angle are set at predetermined positions where the peripheral edges of one side surface of the wafers 23 may be ground. Then, the wafers 23 are subjected to bevelling work. Thereafter, the wafers 23 are removed, and then the same steps are repeated to work the remaining surfaces of the wafers.
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