Title:
GRINDING PAD, GRINDING DEVICE, AND GRINDING METHOD
Document Type and Number:
Japanese Patent JP3843933
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate removing a workpiece from a grinding pad surface after grinding, to decrease a grinding liquid used for grinding, and to reduce a manufacturing cost of a grinding pad.
SOLUTION: A first grinding pad 1 grinding the workpiece is provided with a plurality of long holes 11 penetrating the first grinding pad 1 in a thickness direction thereof. Preferably, the length in a longitudinal direction of the long holes 11 is formed to be not more than 20 mm, and the pitch in a width direction of the long holes 11 is made to be less than 100 mm. Small holes (not shown) may be provided in addition to the long holes 11.
Inventors:
Shunichi Shibuki
Application Number:
JP2002327853A
Publication Date:
November 08, 2006
Filing Date:
November 12, 2002
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/304; B24B37/20; B24B37/26; (IPC1-7): B24B37/00; //H01L21/304
Domestic Patent References:
| JP2001219362A | ||||
| JP2002324769A |
Attorney, Agent or Firm:
Funabashi Kuninori