Title:
研削システム、及び研削方法
Document Type and Number:
Japanese Patent JP7422558
Kind Code:
B2
Abstract:
To provide a technology which suppresses adhesion of particles, which fly up when cleaning a suction surface of a chuck, to a substrate.SOLUTION: A grinding system includes a grinding part which grinds a substrate, a conveying part which carries the substrate in and out the grinding part through a conveyance port on an outer wall of the grinding part, and a control part which controls the grinding part and the conveying part. The grinding part includes a chuck having a suction surface for sucking the substrate, and a chuck cleaning part which cleans the suction surface so as to remove particles adhering to the suction surface of the chuck. The control part inhibits the conveying part from carrying the unground substrate in the grinding part from the conveyance port of the grinding part until the chuck cleaning part finishes cleaning the suction surface.SELECTED DRAWING: Figure 9
Inventors:
Nobutaka Fukunaga
Kazuya Ikegami
Yasushi Seki
Shujiro Ryu
Kazuya Ikegami
Yasushi Seki
Shujiro Ryu
Application Number:
JP2020025408A
Publication Date:
January 26, 2024
Filing Date:
February 18, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B55/06; B24B7/00; B24B41/06; H01L21/304
Domestic Patent References:
| JP3225001U | ||||
| JP2016198874A | ||||
| JP2007301661A |
Foreign References:
| US20130130593 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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