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Title:
GRINDING WHEEL MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2006255821
Kind Code:
A
Abstract:

To provide a grinding wheel manufacturing method for compatibly improving the strength of a grinding wheel in which pores of a grinding chip are impregnated with resins and improving the strength of adhering the interface of the grinding chip to a grinding core with an adhesive.

A raw material composed of a vitrified bond is mixed with super abrasive grains such as CBN or diamond grains, filled in a mold, press-molded and then fired to form the grinding chip. An imprinting material is applied to the core adhesive surface of the grinding chip and hardened, the grinding chip is immersed in liquid resin for vacuum degassing, the pores of the grinding chip are impregnated with the liquid resins, the imprinting material is removed from the grinding chip, and the resins with which the pores of the grinding chip are impregnated are hardened. Thus, a vitrified bond grinding wheel is manufactured.


Inventors:
SEKIYA YASUHISA
HIRAIWA NOBORU
TAKEHARA HIROSHI
IMAIKE HIROSHI
KOJIMA TAKASHI
SOMA SHINJI
Application Number:
JP2005074807A
Publication Date:
September 28, 2006
Filing Date:
March 16, 2005
Export Citation:
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Assignee:
TOYODA VAN MOPPES LTD
JTEKT CORP
International Classes:
B24D3/00; B24D3/18; B24D5/06
Domestic Patent References:
JPS488675B1
JPH05269670A1993-10-19
JPH0819964A1996-01-23
JP2001205566A2001-07-31
Attorney, Agent or Firm:
Kobayashi Osamu
Kazusa Tomita