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Title:
GRINDING WHEEL AND METAL BASE
Document Type and Number:
Japanese Patent JP2008093768
Kind Code:
A
Abstract:

To provide a grinding wheel in no need of thickening the thickness of a metal base unnecessarily, lightweight and easy to deal with, without the risk of grinding a workpiece too much unnecessarily, and to provide the metal base used for this grinding wheel.

In this grinding wheel 10, an abrasive particle layer 20 including a super abrasive particle such as a diamond or CBN abrasive particle is formed at least in a part of the surface of the metal base 11. The metal base 11 is formed of a heat-resisting material with heat resistance with a yield point of 300N/mm2 or more after heat treatment at 800-1100C. Furthermore, the occurrence of sparks at the time of machining can be suppressed by selecting an abrasive particle with high heat conductivity.


Inventors:
KIZAWA SHINICHI
MAZAKI SHIGERU
Application Number:
JP2006276893A
Publication Date:
April 24, 2008
Filing Date:
October 10, 2006
Export Citation:
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Assignee:
KIZAWA SHINICHI
NIPPON DIAMOND CO LTD
International Classes:
B24D3/06; B24D3/00
Domestic Patent References:
JP2002144244A2002-05-21
JPH09263889A1997-10-07
JP2001025970A2001-01-30
JPH02292173A1990-12-03
JP2000001669A2000-01-07
JP2001310264A2001-11-06
JP2002154059A2002-05-28
JP2006026809A2006-02-02
JP2000233373A2000-08-29
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama
Noriko Yanai