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Patent Searching and Data


Title:
GRINDING WHEEL POLISHING DEVICE FOR CYLINDRICAL BODY
Document Type and Number:
Japanese Patent JP2000084804
Kind Code:
A
Abstract:

To provide a grinding wheel polishing device for a cylindrical body capable of two-head polishing and four-head polishing from both sides.

A cylindrical body W is chucked from both sides by chucking means 2 and 4. A driving side spindle 1 is rotated and driven by a motor for rotating a cylinder 9. A movable X table 32a is provided in a longitudinal direction of the cylinder W. A Y table 23a is provided on the X table. A polishing grinding wheel 19b is rotated by a motor for rotating a grinding wheel and an end surface of the polishing grinding wheel 19b is pressed to the cylinder by a constant pressing force so as to polish the cylinder. A ball screw for moving a Y table 29 is rotated by a motor for moving a Y table 23b as a servomotor, and a ball nut for moving a Y table 30 is held elastically through a rubber 31 and held so as not to rotate with respect to the Y table 23a. The motor for moving a Y table 23b rapidly transfers the Y table 23a so that the polishing grinding wheel 19b is in proximity to the cylinder and a constant torque is transmitted by slow rotation.


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Inventors:
SHIGETA TATSUO
YAMAGAMI ETSUJI
KIKUCHI FUMIO
Application Number:
JP27055598A
Publication Date:
March 28, 2000
Filing Date:
September 08, 1998
Export Citation:
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Assignee:
THINK LABS KK
International Classes:
B24B47/04; B24B5/04; (IPC1-7): B24B5/04; B24B47/04
Attorney, Agent or Firm:
Koji Onuma