To provide a grinding wheel in which gettering effect can be maintained without lowering bending strength of a device, and a wafer can be ground without being damaged even when thickness of the wafer becomes thin.

The grinding wheel 5 for grinding a ground surface of a workpiece held by a rotatable chuck table includes a wheel base 51 provided with a grinding water supply hole 440 at its center, and a disk-like grinding stone 52 having a communication hole 521 communicating with the grinding water supply hole at its center, attached under a lower surface of the wheel base. Diamond abrasive grains with grain diameter not more than 5 μm are bonded with a vitrified bond, sintered, and formed in the disk-like grinding wheel. Distance from an inner circumference to an outer circumference of the communication hole 521 in a radial direction is set at a value longer than a radius of the workpiece held by the chuck table.