To provide a grindstone provided with both of dust adhesion resistance and scratch resistance in relation to an object to be polished, having excellent flattening characteristic and mechanical strength (tensile strength, tensile elongation and tensile elastic modulus) of the object to be polished, and usable as polishing of electronic parts without being polished in advance, and the manufacturing method for obtaining the grinding tool with excellent workability and saved energy in a short time.
This grindstone is made by holding organic coated silica A obtained by performing condensation reaction of colloidal silica fine particles (a1) and a hydrolysis product (a2) of organic silane compound by bonding agent (B) containing ethylenically unsaturated compound.
| WO/2002/033020 | METHOD OF MAKING AN AGGLOMERATE PARTICLES |
| JP4790630 | Covered abrasive |
NURISHI SEIJI
FUJIMOTO JUICHI
ISHII TARO
