Title:
地盤探査装置
Document Type and Number:
Japanese Patent JP6990668
Kind Code:
B2
Abstract:
To provide a ground survey device which easily grasps characteristics of a ground in a short time.SOLUTION: A ground survey device 9 surveys a ground 4 by measuring shear waves propagating inside the ground 4. A thrusting part 10 is thrusted into a cutting face 4a from inside an element 6 boring the ground 4. A plurality of receiving piezoelectric parts Rto Rfor receiving shear waves propagating inside the ground 4 are arranged at an interval D in the thrusting part 10. The thrusting part 10 is thrusted into the cutting face 4a from a tip of a steel pipe boring inside the ground 4. The thrusting part 10 is thrusted into the cutting face 4a from a tip end part of the steel element 6 of an under-track crossing construction method for constructing an underground structure under a track without excavating. The thrusting part 10 is a tabular member whose planar shape is a reverse V-shape, and the receiving piezoelectric parts Rto Rare mounted at the interval D along a lengthwise direction of the thrusting part 10.SELECTED DRAWING: Figure 2
Inventors:
Takashi Nakayama
Ryo Takikawa
Ryo Takikawa
Application Number:
JP2019032544A
Publication Date:
January 12, 2022
Filing Date:
February 26, 2019
Export Citation:
Assignee:
Railway Technical Research Institute
International Classes:
G01V1/20; E02D1/02
Domestic Patent References:
| JP2005282115A | ||||
| JP2018115492A | ||||
| JP2017048604A | ||||
| JP2007523276A | ||||
| JP2006265993A | ||||
| JP2000147130A | ||||
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Foreign References:
| US8863862 | ||||
| US20190056523 |
Attorney, Agent or Firm:
Taketo Okuma
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