Title:
地絡位置標定方法及び地絡位置標定システム
Document Type and Number:
Japanese Patent JP6943756
Kind Code:
B2
Abstract:
To provide a ground fault positioning method capable of easily positioning ground fault when a ground fault occurs, while reducing installation cost of a ground fault positioning device.SOLUTION: A propulsion coil device PD includes a plurality of propulsion coil groups 8. The propulsion coil group 8 includes a plurality of propulsion coils 7. The propulsion coil 7 includes a conductor 9a and a semiconductive layer 9c. The conductor 9a is connected across the plurality of propulsion coil groups 8, the semiconductive layer 9c is connected for each propulsion coil group 8, and the plurality of semiconductive layers 9c form a semiconductive layer group 16 for each propulsion coil group 8, and the semiconductive layer group 16 is grounded via a connecting wire 17 for each propulsion coil group 8. The potential of the semiconductive layer group 16 or the current flowing through the connecting wire 17 is measured for each propulsion coil group 8 to locate the ground fault position.SELECTED DRAWING: Figure 6
Inventors:
Taku Sasakawa
Masayuki Aiba
Hideki Shigeeda
Masayuki Aiba
Hideki Shigeeda
Application Number:
JP2017250475A
Publication Date:
October 06, 2021
Filing Date:
December 27, 2017
Export Citation:
Assignee:
Railway Technical Research Institute
International Classes:
G01R31/08; B60L13/03; G01R31/52; H02H3/00; H02H7/08
Domestic Patent References:
| JP3103001A | ||||
| JP6020824A | ||||
| JP8237812A | ||||
| JP3100476A |
Attorney, Agent or Firm:
Higuchi Tenkou