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Title:
積層コアのアース構造
Document Type and Number:
Japanese Patent JP5116908
Kind Code:
B1
Abstract:
To obtain a laminated core grounding structure capable of establishing a ground at reduced cost, a laminated core grounding structure is provided with: a laminated core (1) which is configured by laminating steel sheets (10) each having a plate shape; insulating coverings (11) which respectively cover both surfaces of the steel sheets (10) approximately perpendicular to the lamination direction; a mounting base (5) which conducts to an external ground (7) and to which the laminated core (1) is mounted; a mounting bolt (3) which is screwed into the mounting base (5) to fasten the laminated core (1) to the mounting base (5); and a conduction part (2) which is provided between the head (3a) of the mounting bolt (3) and the steel sheet (10) and brings the mounting bolt (3) and the steel sheet (10) into conduction by breaking the insulating covering (11) by the fastening force of the mounting bolt (3).

Inventors:
Nishii Koichiro
Baba Takenori
Mochizuki Dai
Application Number:
JP2012535493A
Publication Date:
January 09, 2013
Filing Date:
March 09, 2012
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
H02K1/18; F16B5/02; F16B35/00; F16B43/00; H01F27/245; H01F27/26; H02K5/00; H05K7/00
Domestic Patent References:
JP2009177917A2009-08-06
JP2003106319A2003-04-09
JP2009142079A2009-06-25
Attorney, Agent or Firm:
Hiroaki Sakai



 
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