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Patent Searching and Data


Title:
GROUNDING APPARATUS
Document Type and Number:
Japanese Patent JP2003219548
Kind Code:
A
Abstract:

To provide a very simple economical grounding apparatus having a prescribed low ground resistance by joining a large-area contact surface to the side of an existing structural body which has a large-area contact to the ground, and by connecting the ground electrode underground to a connection body.

A ground apparatus comprises a structural body 1, that is at least partially buried underground and a ground electrode 3 that is buried underground, wherein the structural body and the ground electrode are connected underground, while at the same time, the article to be grounded 5 is connected to the ground electrode.


Inventors:
ISHIZAKI MAKOTO
TAKABE JUNICHI
Application Number:
JP2002008555A
Publication Date:
July 31, 2003
Filing Date:
January 17, 2002
Export Citation:
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Assignee:
SANKOSHA CO LTD
International Classes:
H01R4/66; H02B13/02; H02G13/00; (IPC1-7): H02G13/00; H01R4/66; H02B13/02
Attorney, Agent or Firm:
Hirai Tamotsu