Title:
GROUNDING DEVICE
Document Type and Number:
Japanese Patent JP2008152927
Kind Code:
A
Abstract:
To solve the problem that there are many cases that a desired ground resistance value cannot be obtained since a rod like ground body constituting a conventional ground device has a small contact area with earth and accordingly earth resistivity of an installation place is high.
Since a ground conductor is wound around spirally in a region embedded and installed in a vertical hole excavated in the earth of a nonconductive support body, the contact area of the ground conductor and the earth can be made large and accordingly the desired ground resistance value can be obtained.
Inventors:
ISHIZAKI MAKOTO
YONEDA MINORU
YONEDA MINORU
Application Number:
JP2006336500A
Publication Date:
July 03, 2008
Filing Date:
December 14, 2006
Export Citation:
Assignee:
SANKOSHA CO LTD
International Classes:
H01R4/66; H02G7/00; H02G13/00
Domestic Patent References:
JPS6085081A | 1985-05-14 | |||
JP2000030775A | 2000-01-28 | |||
JPH07153541A | 1995-06-16 | |||
JP2006302677A | 2006-11-02 |
Attorney, Agent or Firm:
Yasushi Hirai