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Title:
GROUNDING INSPECTION DEVICE AND GROUNDING INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2014126472
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a grounding inspection device capable of reliably and simply performing grounding inspection on an object to be inspected at low cost.SOLUTION: A grounding inspection device includes: an application electrode 2 formed by a conductor; an AC voltage generating section 4 for generating an AC voltage Vt to be supplied to the application electrode 2; a detection electrode 3 formed by a conductor; a current-voltage converting section 51 for, when the application electrode 2 being supplied with the AC voltage Vt is disposed so as to face an object 20 to be inspected and when the detection electrode 3 is disposed so as to face the object 20 to be inspected, converting a current I flowing from the object 20 to be inspected to the detection electrode 3 into a voltage V1; and a processing section 6 for inspecting the quality of a grounding state of the object 20 to be inspected by comparing the voltage value of the converted voltage V1 with a predetermined threshold voltage value Vr.

Inventors:
KOIKE SHINICHI
Application Number:
JP2012283911A
Publication Date:
July 07, 2014
Filing Date:
December 27, 2012
Export Citation:
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Assignee:
HIOKI EE CORP
International Classes:
G01R31/02; H02H11/00
Attorney, Agent or Firm:
酒井 伸司