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Patent Searching and Data


Title:
GROUNDING OF MICROWAVE CIRCUIT
Document Type and Number:
Japanese Patent JPH02202095
Kind Code:
A
Abstract:

PURPOSE: To enable a printed board to be grounded enough at an optional position by a method wherein a metal pin is inserted into a through-hole provided inside a ground pattern until one end of it reaches a through-hole stopper, the other end is held by a conductive metal pin retaining part, and an elastic metal contact section is brought into contact with a metal lid on a component mounting side.

CONSTITUTION: A conductive metal pin retaining section 4 is fixed to a metal lid 22 on a pattern face side of a printed board 11. A metal pin 3 is provided with a metal rod 31, which is small enough in diameter to penetrate through a through-hole 12 provided to a printed board 11, where an elastic metal contact part 33 is provided to one end of the rod 31 and a through-hole stopper 32 is provided to a part of the rod 31 separate from the end by a specified distance. The metal pin 3 is inserted into the through-hole 12 provided in the grounding pattern on the pattern side as far as the through-hole stopper 32, the elastic metal contact part 33 is brought into contact with a metal lid 21 on a component mounting face side of the printed board 11, and the other end of the metal rod 31 is held by the conductive metal pin retaining section 4 to ground the printed board to a metal case 17. By this setup, a printed board can be grounded sufficiently at an optional position.


Inventors:
NAKADA KATSUMI
Application Number:
JP2129789A
Publication Date:
August 10, 1990
Filing Date:
January 31, 1989
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01R4/64; H05K7/14; (IPC1-7): H01R4/64; H05K7/14
Attorney, Agent or Firm:
Sadaichi Igita