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Patent Searching and Data


Title:
GROUNDING STRUCTURE OF WIRING BOARD
Document Type and Number:
Japanese Patent JP2010123905
Kind Code:
A
Abstract:

To obtain a structure for reducing unnecessary electromagnetic radiation from a wiring board for communication.

A wiring board includes: a first grounding plane 11; a circuit board 1 provided with an insulated second grounding plane 12 on the same plane as the first grounding plane 11; an operation means 2 that is implemented on the circuit board 1, connected with the first grounding plane 11, and provided with a communication terminal; a reactance element 3 that is implemented on the circuit board 1 and connected with the second grounding plane 12; a first wiring 41 that is connected with the communication terminal of the operation means 2 to transmit and receive communication signals; and an elastic flexible printed wiring board (wiring board 4) on which a second wiring 42 is provided that is connected with the second grounding plane 12 via a reactance element 3.


Inventors:
ISHIZAWA KENTA
Application Number:
JP2008298884A
Publication Date:
June 03, 2010
Filing Date:
November 24, 2008
Export Citation:
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Assignee:
NIPPON SEIKI CO LTD
International Classes:
H05K9/00; H03K19/0175