To produce a group III nitride-based compound semiconductor having uniformly oriented crystal axis, and having m-plane as a main surface.
A projection part having a side surface whose off-angle from c-plane is ≤45° is formed on a sapphire substrate having a-plane as a main surface. Subsequently, trimethyl aluminum is supplied at 300-420°C, to thereby form an aluminum layer having a thickness of ≤40 Å, and then to obtain an aluminum nitride layer after being nitrided. Consequently, a group III nitride-based compound semiconductor is epitaxially grown only from a side surface having an off-angle of ≤45° from the c-plane of the projection part in the sapphire substrate having the a-plane as the main surface. Thus, a group III nitride-based compound semiconductor having m-plane which is parallel to the main surface of the sapphire substrate can be formed.
NITTA SHUGO
SAITO YOSHIKI
USHIDA YASUHISA
NAKADA NAOYUKI
BOYAMA SHINYA
JP2006232640A | 2006-09-07 | |||
JP2000106455A | 2000-04-11 | |||
JP2002362999A | 2002-12-18 | |||
JP2000106455A | 2000-04-11 | |||
JP2002362999A | 2002-12-18 | |||
JP2006232640A | 2006-09-07 |
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