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Title:
GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR, WAFER HAVING GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR FORMED THEREON, AND GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2013241337
Kind Code:
A
Abstract:

To produce a group III nitride-based compound semiconductor having uniformly oriented crystal axis, and having m-plane as a main surface.

A projection part having a side surface whose off-angle from c-plane is ≤45° is formed on a sapphire substrate having a-plane as a main surface. Subsequently, trimethyl aluminum is supplied at 300-420°C, to thereby form an aluminum layer having a thickness of ≤40 Å, and then to obtain an aluminum nitride layer after being nitrided. Consequently, a group III nitride-based compound semiconductor is epitaxially grown only from a side surface having an off-angle of ≤45° from the c-plane of the projection part in the sapphire substrate having the a-plane as the main surface. Thus, a group III nitride-based compound semiconductor having m-plane which is parallel to the main surface of the sapphire substrate can be formed.


Inventors:
OKUNO KOJI
NITTA SHUGO
SAITO YOSHIKI
USHIDA YASUHISA
NAKADA NAOYUKI
BOYAMA SHINYA
Application Number:
JP2013177108A
Publication Date:
December 05, 2013
Filing Date:
August 28, 2013
Export Citation:
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Assignee:
TOYODA GOSEI KK
International Classes:
C30B29/38; H01L21/205
Domestic Patent References:
JP2006232640A2006-09-07
JP2000106455A2000-04-11
JP2002362999A2002-12-18
JP2000106455A2000-04-11
JP2002362999A2002-12-18
JP2006232640A2006-09-07
Attorney, Agent or Firm:
Osamu Fujitani