Title:
【発明の名称】半導体装置の製法
Document Type and Number:
Japanese Patent JP3122103
Kind Code:
B2
Inventors:
Nobuyuki Yoshitake
Application Number:
JP27653389A
Publication Date:
January 09, 2001
Filing Date:
October 24, 1989
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L29/73; H01L21/265; H01L21/331; H01L21/337; H01L21/338; H01L29/732; H01L29/808; H01L29/812; (IPC1-7): H01L21/265; H01L21/331; H01L21/337; H01L29/73; H01L29/808
Domestic Patent References:
| JP6159723A |
Attorney, Agent or Firm:
Hidemori Matsukuma