Title:
HIGH SOLID hBN SLURRY, hBN PASTE, SPHERICAL hBN POWDER, AND METHOD OF PRODUCING AND USING THEM
Document Type and Number:
Japanese Patent JP2009035484
Kind Code:
A
Abstract:
To provide thermally conductive filler materials which can be used at high fill levels to achieve sufficient thermal conductivity without increasing viscosity.
The present invention relates to a method of producing a spherical boron nitride powder and a method of producing a hexagonal boron nitride paste using a hexagonal boron nitride slurry. Another aspect of the present invention relates to a hexagonal boron nitride paste including about 60-about 80 wt.% solid hexagonal boron nitride. Yet another aspect of the present invention relates to a spherical boron nitride powder, a polymer blend including a polymer and the spherical boron nitride powder, and a system including such a polymer blend.
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Inventors:
PUJARI VIMAL K
COLLINS WILLIAM T
KUTSCH JEFFREY J
COLLINS WILLIAM T
KUTSCH JEFFREY J
Application Number:
JP2008286337A
Publication Date:
February 19, 2009
Filing Date:
November 07, 2008
Export Citation:
Assignee:
SAINT GOBAIN CERAMICS
International Classes:
C01B21/064; C08K3/38; C08L101/00; C09K5/14; C09K23/52; C09K23/54; H01L23/373; H05K7/20
Domestic Patent References:
| JPH09202663A | 1997-08-05 | |||
| JPH09202663A | 1997-08-05 | |||
| JPH1160216A | 1999-03-02 | |||
| JPH1160215A | 1999-03-02 | |||
| JPH04164805A | 1992-06-10 | |||
| JPS6345104A | 1988-02-26 | |||
| JP2001172604A | 2001-06-26 | |||
| JPH0741311A | 1995-02-10 | |||
| JPH08183906A | 1996-07-16 | |||
| JPS636093A | 1988-01-12 | |||
| JPH06219714A | 1994-08-09 | |||
| JPH07204492A | 1995-08-08 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu