Title:
MANUFACTURING SYSTEM FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3154684
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a manufacturing system for semiconductor device in which a resin package is formed only on one side of the substrate and with high reliability.
SOLUTION: In a manufacturing system for semiconductor device in which a resin package 72 is formed on one side of a lead frame 70 using a die 32 comprising a pair of die halves 34, 36, an anchor cavity 58 for forming an anchor part 74 coupling package cavities 56 adjacent to the cavity insert 44 for upper die is provided between them.
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Inventors:
Hidaka, Masafumi
Maki, Shinichiro
Oyama, Nobuo
Orimo, Masaichi
Sakota, Eiji
Yoneda, Yoshiyuki
Maki, Shinichiro
Oyama, Nobuo
Orimo, Masaichi
Sakota, Eiji
Yoneda, Yoshiyuki
Application Number:
JP31532497A
Publication Date:
April 09, 2001
Filing Date:
November 17, 1997
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B29C45/32; B29C45/02; B29C45/14; B29C45/40; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02
Attorney, Agent or Firm:
伊東 忠彦