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Title:
疎水変性したアミドシリコーンコポリオールを含むヘアまたはスキンコンディショニング組成物
Document Type and Number:
Japanese Patent JP4532567
Kind Code:
B2
Abstract:
Disclosed are hair or skin conditioning compositions comprising by weight: (a) from about 0.1% to about 10% of a thickening polymer system; (b) from about 0.1% to about 8.0% of a surfactant system selected from the group consisting of cationic surfactant, nonionic surfactant, and mixtures thereof; (c) from about 0.1% to about 10% of a hydrophobically modified amido silicone copolyol; and (d) an aqueous carrier; wherein the composition has a transmittance of 25% or more and/or wherein the composition has a viscosity of from about 1,000 cps to about 50,000 cps and Shear Thinning Index of 30 or more. The compositions are especially suitable for hair care products such as hair conditioning products for rinse-off/leave-on use.

Inventors:
Uehara Nobuaki
Tomomi Asari
Komure Natsumi
Application Number:
JP2007555387A
Publication Date:
August 25, 2010
Filing Date:
February 21, 2006
Export Citation:
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Assignee:
THE PROCTER & GAMBLE COMPANY
International Classes:
A61K8/898; A61K8/39; A61K8/41; A61K8/73; A61Q5/12; A61Q19/00; C08G77/46
Domestic Patent References:
JP2007520567A
Foreign References:
WO2004032887A1
WO2004108099A1
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku