Title:
BONDING TOOL AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3189372
Kind Code:
B2
Abstract:
PURPOSE: To obtain a bonding tool having better wear resistance by providing (111) plane for the principal diamond crystal plane forming the tip surface for pressing.
CONSTITUTION: In a bonding tool 10 consisting of a polycrystal diamond 5 for which the top surface 15 is vapor grown for thermocompression bonding, the principal diamond crystal surface forming the tip surface 15 is made to (111) plane. Also, a base member 4 having a surface for depositing diamond is prepared, and the diamond 5 is deposited on the surface by the gas phase synthesis in such a manner that the plane (111) will be positioned in parallel to the surface. Then, a diamond layer is deposited in such a manner that a crystal surface having a lower hardness than the plane (111) will be positioned on the diamond 5. Then, the base member 4 is bonded to a tool body 1 by brazing with the diamond layer made as the tip surface, the diamond layer is removed by mirror polishing process and then plane (111) is exposed.
Inventors:
Keiichiro Tanabe
Toshiya Takahashi
Akihiko Ikegaya
Toshiya Takahashi
Akihiko Ikegaya
Application Number:
JP10481092A
Publication Date:
July 16, 2001
Filing Date:
April 23, 1992
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/60; H01L21/603; (IPC1-7): H01L21/603; H01L21/60
Domestic Patent References:
| JP2224349A | ||||
| JP167750U |
Other References:
【文献】”結晶工学ハンドブック”、共立出版株式会社、編集委員長山本美喜雄、1985年9月25日初版4刷発行、1321頁、A.硬さの方向性
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)
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