Title:
HALL ELEMENT
Document Type and Number:
Japanese Patent JPS5946076
Kind Code:
A
Abstract:
PURPOSE:To prevent a Hall element from exfoliation of lead wires by a method wherein electrodes overlapped on the edge parts of a compound semiconductor layer on a flat substrate are provided extending over the substrate, and the lead wires are connected to the electrode parts on the substrate. CONSTITUTION:The InSb layer 12 is evaporated on the Si substrate 11 covered with a thermal oxide film, and the two layer electrodes 13 of Cr-Au are provided overlapping on the edge parts thereof and extending over the substrate 11. The Au wires 15 are connected to the electrodes 13 on the substrate 11, and the other edges thereof are connected to the lead wires 14. After then, the device is sealed with resin. According to this construction, when the electrodes 13 are enlarged, sufficient adhesion with the substrate 11 can be obtained, and moreover, because the semiconductor 12 is protected from pressure at junction time of the lead wires 14 and the Au wires 15 and from distortion to be applied from the lead wires 14 after completion, the high reliable Hall element can be obtained. Moreover because the device is made to have two layer structure of Cr- Au, reliability about junction is extremely made high.
Inventors:
TAMURA YASUHIKO
ABE YUUZOU
ABE YUUZOU
Application Number:
JP15713882A
Publication Date:
March 15, 1984
Filing Date:
September 08, 1982
Export Citation:
Assignee:
SANYO ELECTRIC CO
TOKYO SANYO ELECTRIC CO
TOKYO SANYO ELECTRIC CO
International Classes:
H01L43/04; H01L43/14; (IPC1-7): H01L43/06
Domestic Patent References:
| JP50074874B | ||||
| JPS5329103U | 1978-03-13 | |||
| JPS5015480A | 1975-02-18 |
Attorney, Agent or Firm:
Takuji Nishino