Title:
Hall sensor device and its manufacturing method
Document Type and Number:
Japanese Patent JP6347517
Kind Code:
B2
Abstract:
The present invention refers to a Hall sensor device and a manufacturing method thereof. The Hall sensor device includes: two sensor chips each including two pins; a shell, in which four conductive terminals electrically connected with four pins respectively are arranged; three output pins electrically connected to three of the conductive terminals respectively; and a bridge suitable for electrically connecting the rest conductive terminal with the congeneric conductive terminal in the three conductive terminals. The manufacturing method includes: integrally molding the shell and four output pins electrically connected with the four conductive terminals respectively, and cutting off the output pin electrically connected with said rest conductive terminal and providing the bridge. By adopting the present invention, the manufacturing cost of the sensor device is reduced and the production efficiency is improved. Two configurations can be manufactured: one in which the two power supply pins are connected with each other, the other in which the two signal pins are connected with each other.
Inventors:
Thien Shun Wu
Chuyong Way Huang
Chuyong Way Huang
Application Number:
JP2014263980A
Publication Date:
June 27, 2018
Filing Date:
December 26, 2014
Export Citation:
Assignee:
Sensata Technologies Massachusetts, Inc.
International Classes:
G01P3/487; G01P1/02; G01P3/488
Domestic Patent References:
| JP10246650A |
Foreign References:
| US4857842 | ||||
| US5372435 | ||||
| US5998988 |
Attorney, Agent or Firm:
Kyozo Katayose