To provide an epoxy resin composition which shows good flame retardancy without containing a halogen (halogen-free) and can prevent the occurrence of bleeding on the pressing at high temperatures and besides which is excellent in soldering heat resistance.

This halogen-free flame retardant epoxy resin composition includes the essential components of (A) a cyclophosphazene compound, (B) a polyepoxide compound, (C) a hardener for use in epoxy, (D) a curing accelerator for use in epoxy, and (E) a styrene-maleic anhydride-based copolymer.