Title:
HANDLING DEVICE AND HANDLING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JP2008013372
Kind Code:
A
Abstract:
To provide a handling method particularly suitable for carrying a wafer having the thickness less than 100 m, in a handling device and the corresponding wafer handling method operated by a method extremely friendly to the wafer.
In this handling device and the handling method of the wafer 4 having the thickness of 100 m or less, the handling device and the handling method can adjust the contact area between a pressure sensitive adhesive film and the wafer, by increasing-decreasing the volume of a work space, by arranging the pressure sensitive adhesive film for partitioning the work space 8 into at least one for increasing and decreasing the volume by supplying or removing a pressurizing medium.
Inventors:
THALLNER ERICH
Application Number:
JP2007178652A
Publication Date:
January 24, 2008
Filing Date:
July 06, 2007
Export Citation:
Assignee:
THALLNER ERICH
International Classes:
B65G49/07; B25J15/00; B65G49/06; H01L21/677
Domestic Patent References:
| JP2004079613A | 2004-03-11 | |||
| JPH10128634A | 1998-05-19 | |||
| JP2005093938A | 2005-04-07 | |||
| JPH09108983A | 1997-04-28 | |||
| JP2002265040A | 2002-09-18 | |||
| JP2006000930A | 2006-01-05 | |||
| JP2003133395A | 2003-05-09 |
Foreign References:
| WO2005098522A1 | 2005-10-20 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro