Title:
プログラマブルな材料圧密化システムと共に使用される取り扱いシステム及び関連する方法
Document Type and Number:
Japanese Patent JP2006506249
Kind Code:
A
Abstract:
A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
More Like This:
Inventors:
Farnworth, Wallen M
Hyatt, William M
Henbury, David Earl
Benson, Peter A
Ahmad, Side Sajid
Hess, Michael Yee
Hyatt, William M
Henbury, David Earl
Benson, Peter A
Ahmad, Side Sajid
Hess, Michael Yee
Application Number:
JP2004552248A
Publication Date:
February 23, 2006
Filing Date:
November 11, 2003
Export Citation:
Assignee:
MICRON TECHNOLOGY,INC.
International Classes:
B29C67/00; H01L21/02; H01L21/304
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Shigeru Sakuma
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Shigeru Sakuma