To provide a handrail of which the covering material is made of resin which is formed by using and foaming a thermal expansion microcapsule.

A thermoplastic resin is used, and the thermal expansion microcapsule is formed by performing microencapsulation of a volatile expanding material which becomes like gas at temperatures smaller than or equal to the softening point of the thermoplastic resin. The foamed resin molded object is manufactured by adding the thermal expansion microcapsule to a basic soft synthetic resin and treating it with heat. Then the foamed resin molded object is attached to a core material of a handrail as the covering material.