Title:
HARD FLOOR MATERIAL
Document Type and Number:
Japanese Patent JP2021185299
Kind Code:
A
Abstract:
To provide a thin resin floor material capable of absorbing surface irregularities of a floor substrate, while having relatively high strength and hardness.SOLUTION: A floor material includes a resin-containing hard layer and a surface layer on an upper layer thereof, and a warpage prevention layer as a lower layer of the resin-containing hard layer. In the hard floor material, (1) a thickness of the floor material is 5 mm or less, and (2) at a temperature of 23°C, a suspension amount is 0.5-8 mm by dead weight of a region A of a residual width of 5 cm and a length of 20 cm when fixing a region B of a width of 5 cm and a length of 10 cm from an end part of a sample of a width of 5 cm and a length of 30 cm of the floor material.SELECTED DRAWING: Figure 1
More Like This:
| WO/2016/113706 | FLOOR PANEL FOR FORMING A FLOOR COVERING |
| WO/2021/014307 | A FLOOR PANEL HAVING TEXTURE ZONES ON THE TOP SURFACE |
Inventors:
TAKEKAWA MASAKATSU
FURUYA SHINICHI
MATSUDA SHIGERU
MATSUMOTO TATSUKI
OSAKI HIROSHI
FURUYA SHINICHI
MATSUDA SHIGERU
MATSUMOTO TATSUKI
OSAKI HIROSHI
Application Number:
JP2020109998A
Publication Date:
December 09, 2021
Filing Date:
June 25, 2020
Export Citation:
Assignee:
TOLI CORP
International Classes:
E04F15/10; B32B7/022; E04F15/02
Attorney, Agent or Firm:
Jun Fujii